Teledyne e2v HiRel Electronics (HiRel) provides microelectronics packaging and products with a full range of packaging solutions from COTS to Class K. We can provide services from prototypes to fully qualified production
Our engineering teams offer creative packaging solutions for today's most demanding applications, including:
- Multichip Packages (MCP)
- System on a Package (SOP)
- Plastic Ball Grid Array (PBGA)
- Quad Flat Package No Leads (QFN)
- Single Chip Packages
Our customer base, which includes the U.S. Government and prime contractors, demands uncompromising quality, reliability and timely delivery. Our numerous certifications including AS9100, ISO 9001, and MIL-PRF-38534 Class H and K accreditation, all of which are integral factors in our company-wide initiative to deliver high-reliability microelectronic devices that meet our customers' stringent requirements. We are a DOD Trusted Source for Microelectronics Packaging, Assembly, and Test.