Teledyne e2v HiRel provides microelectronics packaging and products with a full range of packaging solutions from COTS to MIL-PRF-38534 compliant (Class H & K) qualifications. HiRel provides a one stop solution for your microelectronic assembly, evaluation, test and screening requirements. Our MCM packaging technology enable our customers to meet size, weight, power and cost (SWaPC) requirements without a sacrifice in performance.
Our numerous certifications including AS9100, ISO 9001, and MIL-PRF-38534 Class H accreditation, all of which are integral factors in our company-wide initiative to deliver high-reliability microelectronic devices that meet our customers' stringent requirements. We are a DOD Trusted Source for Microelectronics Packaging, Assembly, and Test.