e2v HIREL ELECTRONICS 

Platform Extensions

Semiconductor Lifecycle Management (SLiM™)

Defense and space applications no longer drive the semiconductor industry. There is such a mismatch between the market life of a modern semiconductor, which can be measured in months to a couple of years, and the platform needs of defense and space platforms, measured in decades.

Semiconductor Lifecycle Management (SLiM™) from Teledyne e2v HiRel Electronics solves this headache. We have many years of experience partnering with customers to save cost and lower risk when dealing with platform extensions.

Download the Whitepaper here.​

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Banked Parts

 

  
A. Die Banking  
We manage the storage of many thousands of wafers in safe, environmentally controlled conditions. Many of these are inventory that we have purchased from other semiconductor suppliers who have wanted to dispose of them; we also manage wafers for clients who have carefully evaluated where they will be vulnerable on key programs and have contracted us for surety of supply.  
Examples of our extensive collection include:  
  • Cypress 37K CPLDs
  • IDT FCT logic
  • National Semiconductor military logic families
  
  
  
  
A. Die Banking  
We manage the storage of many thousands of wafers in safe, environmentally controlled conditions. Many of these are inventory that we have purchased from other semiconductor suppliers who have wanted to dispose of them; we also manage wafers for clients who have carefully evaluated where they will be vulnerable on key programs and have contracted us for surety of supply.  
Examples of our extensive collection include:  
  • Cypress 37K CPLDs
  • IDT FCT logic
  • National Semiconductor military logic families
  
  
  
  
B. Repackaging  
While some devices may still be available, they may not be obtainable in the ruggedized or specialized packaging required for a particular program.  
Example: Missile Program  
  • Device: LM741
  • Requirement: Custom Gull Wing Package
  • Result: HiRel qualified to customer
    specification
  
  
  
  
B. Repackaging  
While some devices may still be available, they may not be obtainable in the ruggedized or specialized packaging required for a particular program.  
Example: Missile Program  
  • Device: LM741
  • Requirement: Custom Gull Wing Package
  • Result: HiRel qualified to customer
    specification
  
  
  
  
C. Interposer/ Pin-Mapping  
A related area to repackaging, interposing (also sometimes called pin-mapping) is the ability we are also able to take parts with functions required to keep a circuit functioning and create suitable interposers to allow the device to directly replace obsolete parts without needing to change on-board layout.  
Example: Aircraft EW System  
Problem  
  • MUX/DeMUX End of Life (EoL) issued
Solution  
  • Teledyne e2v HiRel Electronics was able to identify/ procure similar device/function
  • Interposer designed to map new die to required pinout
  • Device completed system level testing
  • New device working “perfectly” in system
  
  
  
  
C. Interposer/ Pin-Mapping  
A related area to repackaging, interposing (also sometimes called pin-mapping) is the ability we are also able to take parts with functions required to keep a circuit functioning and create suitable interposers to allow the device to directly replace obsolete parts without needing to change on-board layout.  
Example: Aircraft EW System  
Problem  
  • MUX/DeMUX End of Life (EoL) issued
Solution  
  • Teledyne e2v HiRel Electronics was able to identify/ procure similar device/function
  • Interposer designed to map new die to required pinout
  • Device completed system level testing
  • New device working “perfectly” in system
  
  
  
  
D. Re-Balling  
An issue that applies equally to current and formerly available parts is the need to be able to use tin lead solder. All new semiconductors utilize RoHS compliant packaging, and lead-free does not meet the needs of defense & space applications We can re-process parts to have tin lead solder. This applies to BGA packages with solder balls, which can be converted from lead-free to tin-lead.  
Example Re-Balling Problem  
  • Micron End of Life (EoL) notice for SnPb version
  • Customer wanted long term support for SnPb option
Solution  
  • Teledyne HiRel qualified to customer specification
  
  
  
 
  
  
  
D. Re-Balling  
An issue that applies equally to current and formerly available parts is the need to be able to use tin lead solder. All new semiconductors utilize RoHS compliant packaging, and lead-free does not meet the needs of defense & space applications We can re-process parts to have tin lead solder. This applies to BGA packages with solder balls, which can be converted from lead-free to tin-lead.  
Example Re-Balling Problem  
  • Micron End of Life (EoL) notice for SnPb version
  • Customer wanted long term support for SnPb option
Solution  
  • Teledyne HiRel qualified to customer specification
  
  
  
 
  
  
  
E. Memory Stacking  
A common method of obtaining more memory on a given circuit layout is to stack memory chips on top of each other. Replicating this in a reliable, rugged and qualified way is challenging, to say the least. We have helped customers as part of resurrections, and also when their existing stacking supplier is failing to meet expectations.  
Example: Avionic Application  
Problem  
  • Existing memory stacking supplier EoL their offering
Solution  
  • Parts resurrection & memory stacking
  • Pin compatible replacement for Crucial’s 1G-bit DDR1 STAPAKS®
  • Teledyne e2v HiRel Electronics qualified to customer specification
  
  
  
 
  
  
  
E. Memory Stacking  
A common method of obtaining more memory on a given circuit layout is to stack memory chips on top of each other. Replicating this in a reliable, rugged and qualified way is challenging, to say the least. We have helped customers as part of resurrections, and also when their existing stacking supplier is failing to meet expectations.  
Example: Avionic Application  
Problem  
  • Existing memory stacking supplier EoL their offering
Solution  
  • Parts resurrection & memory stacking
  • Pin compatible replacement for Crucial’s 1G-bit DDR1 STAPAKS®
  • Teledyne e2v HiRel Electronics qualified to customer specification
  
  
  
 
  
  
  
F. Parts Resurrection  
When no wafers were set aside, no replacement parts can be bought on the open market, and no magic can be applied to repackage a modern part to fit a legacy application, all avenues are exhausted. At this point we are able to take a golden unit, and reverse engineer it from the ground up. We meticulously de-process the unit, use any documentation that might be available, a microscope, and recreate new wafers from scratch.  
Example: Missile  
  • Redesign of obsolete RM4260 with potential add on of the RA2916
  • Qualify to customer specification and generic part to allow drop in replacement
  
  
  
 
  
  
  
F. Parts Resurrection  
When no wafers were set aside, no replacement parts can be bought on the open market, and no magic can be applied to repackage a modern part to fit a legacy application, all avenues are exhausted. At this point we are able to take a golden unit, and reverse engineer it from the ground up. We meticulously de-process the unit, use any documentation that might be available, a microscope, and recreate new wafers from scratch.  
Example: Missile  
  • Redesign of obsolete RM4260 with potential add on of the RA2916
  • Qualify to customer specification and generic part to allow drop in replacement
  
  
 
  
  
 
 

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