Teledyne Labtech prides itself in being at the forefront of RF/Microwave PCB development. Teledyne Labtech were also one of the first companies to successfully develop techniques for embedding SMD resistors and capacitors within multilayer structures and the embedding of connector pins in buried stripline circuits.
The advantages of such a structures ensures a much higher density of interconnect. This then removes the need for via-hole connections to the board surface or the need to create access pockets to the inner layers. Consequently you finish with a board with that exhibits much lower RF/Microwave losses. This is particularly important when designing large RF feed networks or 16:1 power dividers.
Embedded SMT Device
Connection to Buried Stripline
Embedded connector pin in RF/Microwave Feed Network