Credit Card Assembly: Systems Integration
Teledyne Advanced Electronic Solutions integrates CCAs and other sub-assemblies, cables and fabricated parts into system modules shipped directly to customers for integration into their products.
- Box Build: custom built to order system solutions
- High complexity box assemblies and subsystems
- High frequency RF box assemblies and subsystems
- Full functional RF testing up to 26 GHz (K band)
- Multi-level systems integration – build and test modules and CCAs and integrate into higher level assemblies
- Custom cell design for customer subsystems
- Special bonding processes including thermal management and vibration
- Robust torque and FOD control programs
- System level testing including functional, vibration and thermal
- Complex harness fabrication and integration
- Fiber-Optic and RF waveguide integration and testing
- Large system capacity in excess of 200 lbs.
- Configure to order – Integrate different options, firmware, configurations, etc across a single order as required