ADVANCED ELECTRONIC SOLUTIONS 

X-Ray Inspection

  • Teledyne EMS has x-ray capability for the inspection of hidden solder joints and other parameters not easily visible through normal inspection methods.
  • Automated x-ray inspection is available for product running at significant volumes with complex hidden features.  Digital tomosynthesis technology can aquire multiple images at different slice heights in one inspection cycle.
  • Manual 2D x-ray may be used for inspection, process qualification, and other applications.  Spot size to less than 1 um provides the versatility for a variety of electronic assembly applications.
  • All x-ray inspections and images are recorded and maintained so that they can be recalled by assembly serial number and reference designator at a later time

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