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ADVANCED ELECTRONIC SOLUTIONS
ABOUT
PRODUCTS/SERVICES
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TERMS & CONDITIONS
Teledyne Defense Electronics
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Teledyne Advanced Electronic Solutions
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Processes
Processes
Assembly Cleaning
Automated Optical Inspection
BGA/Device Underfill
Bonding/Coating
Circuit Card Assembly
Component Placement
Material Dispensing
Pin Thru Hole Assembly
Reflow Soldering
Secondary Assembly
Solder Paste
Specialized Rework
X-Ray Inspection
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Processes
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