Solder Paste

Solder Paste Application
  • Teledyne EMS custom designs stencils for the specific application and customer requirement
  • Paste application is controlled using automated vision-aligned stencil printers

3D Solder Paste Inspection
  • Teledyne EMS inspects 100% of solder paste deposits using automated Solder Paste Inspection systems
  • Each solder deposit is measured for coverage, height, and volume to ensure the proper amount of solder for each solder joint created in the SMT process
  • The Solder Paste Inspection system retains inspection data for each deposit location such as SPC, analysis, and other key locations