Teledyne Advanced Electronic Solutions possesses in depth testing capabilities with an array of automatic and semi-automatic testers.   Depending on the type of multichip module or hybrid, all devices will undergo a stringent set of test methodologies, including electrical DC, high speed, optical and RF/Microwave testing throughout all stages of the assembly and manufacturing process.  Testing is performed in accordance with MIL-STD and customer requirements.

Teledyne's experienced team of dedicated test engineers with ensure that all requirements are met.