Substrate/Package Stack-up Analysis
Teledyne Advanced Electronic Solutions approach to substrate design starts with a sizing study of major components and available technologies. Teledyne works with multiple materials to select the appropriate material for the job including:
- Low temperature co-fired ceramic (LTCC)
- High temperature co-fired ceramic (HTCC)
- Thick film ceramic (AlN and BeO)
- Direct Bond Copper (DBC)
Characteristics to consider include: range of dielectric constants, operating frequencies, thermal properties, dissipation factor, temperature stability, mechanical strength and cost. By combining the right mix of properties, the result is a product that offers excellent electrical performance, while significantly increasing the density of the integrated components and reducing the package module footprint. This ensures a high reliability, technologically superior product tailored to match specific application needs.
For board layout and simulation, Teledyne utilizes a vareity of design tools. These tools allow for ongoing design simulation to predict and eliminate signal and power integrity problems early. The end result is a design that optimizes topologies and terminations of clocks and other critical signals prior to board layout, providing a comprehensive signal integrity and timing verification and analysis.
Teledyne's substrate design experience enables us to select the standard process and material combinations best suited for your requirements.