Teledyne Labtech is unique in offering a complete microelectronic assembly capability. This includes MMIC die-placement, wire bonding, ribbon bonding, wedge bonding and ball bonding.
This capability ensures that any RF/Microwave PCB and assembly meets with the most demanding defence and space applications.
- Die attach
- Gold wire & ribbon bonding
- SMT assembly
- Connector assembly
Click on the links below to view our product lines.