LABTECH 

Microelectronic Assembly

Teledyne Labtech is unique in offering a complete microelectronic assembly capability. This includes MMIC die-placement, wire bonding, ribbon bonding, wedge bonding and ball bonding.

This capability ensures that any RF/Microwave PCB and assembly meets with the most demanding defence and space applications.

  • Die attach
  • Gold wire & ribbon bonding
  • SMT assembly
  • Connector assembly  
Click on the links below to view our product lines.
 

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