Labtech

Teledyne Labtech

Designing Microwave PCBs
for Successful Manufacture

Microelectronic Assemblies

Teledyne Labtech is unique in offering a complete microelectronic assembly capability. This includes MMIC die-placement, wire bonding, ribbon bonding, wedge bonding and ball bonding.

Click on the links below to view our product lines.

- RF-MW Assembly Capability / Labtech
- RF-MW Test Capability / Labtech

RF/Microwave PCBs

Teledyne Labtech is recognised as a world leading supplier of complex RF PCB and Microwave Printed Circuit Boards. With over 35 years’ experience, Teledyne Labtech is your “one-stop” solution for design, manufacture and test of the most demanding RF/Microwave PCB designs.

Click on the links below to view our product lines.

- PCB - Embedded Components
- PCB - Large Format
- PCB - Materials
- PCB - Metal Cored
- PCB - Multilayer
- PCB - OhmegaPly®
- PCB - Post - Bonded Metalbacked
- PCB - Pre - Bonded Metalbacked

Designing Microwave PCBs for Successful Manufacture

Microelectronic Assemblies

​RF/Microwave PCBs

Designing Microwave PCBs
for Successful Manufacture

RF/Microwave PCBs