LABTECH 
In-House Capabilities

 

Designing Microwave PCBs
for Successful Manufacture

 

Microelectronic Assembly

Teledyne Labtech offers a comprehensive build-to-print microwave module and microwave components manufacturing service. Our microwave MIC production facility is housed in a class 10,000 clean room with manual chip placement and semi-automatic wire bond assembly. Dedicated microwave components manufacturing is undertaken within production cells established to meet specific customer or product requirements.
 

Manufacturing Capability

  • MIC Assembly
    • Semi-automatic chip and wire assembly
    • Wedge-wedge wirebonding
    • Ball-wedge wirebonding
    • Gold tapes for DC and RF connections
  • In-house RF machining and box build
  • In-house microwave PCB manufacture
  • In-house painting facilities

 

 

CONTACT US    |    TELEDYNE CAREERS    |    TELEDYNE TECHNOLOGIES

             

 

© Copyright 2019, Teledyne Defense Electronics