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ADVANCED ELECTRONIC SOLUTIONS
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Teledyne Advanced Electronic Solutions
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Processes
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Material Dispensing
Processes
Assembly Cleaning
Automated Optical Inspection
BGA/Device Underfill
Bonding/Coating
Circuit Card Assembly
Component Placement
Material Dispensing
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Pin Thru Hole Assembly
Reflow Soldering
Secondary Assembly
Solder Paste
Specialized Rework
X-Ray Inspection
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Material Dispensing
Teledyne EMS can dispense epoxies to hold SMT parts on double-sided assemblies for soldering at the wave solder operation.
Teledyne EMS dispenses solder paste for a variety of applications where obstructions on the CCA surface prohibit normal stencil printing
Teledyne EMS automates the dispense of bonding material for various components that require additional support to meet the requirements of high vibration or shock environments
Material dispensing processes have also been used for sealing operations on systems to seal the systems against water, dust, and other environmental conditions
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