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ADVANCED ELECTRONIC SOLUTIONS
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Teledyne Advanced Electronic Solutions
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Processes
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Component Placement
Processes
Assembly Cleaning
Automated Optical Inspection
BGA/Device Underfill
Bonding/Coating
Circuit Card Assembly
Component Placement
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Material Dispensing
Pin Thru Hole Assembly
Reflow Soldering
Secondary Assembly
Solder Paste
Specialized Rework
X-Ray Inspection
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Component Placement
Teledyne EMS has 4 SMT lines focused on Military/Aerospace production where tin whisker mitigation is critical
One SMT line is dedicated to Commercial assembly to meet RoHS requirements
Teledyne EMS is currently placing 0201 chip components in regular production. 01005 chips have been successfully placed in Engineering trials.
Large components up to 2” x 6” are within Teledyne EMS SMT placement capabilities
Teledyne EMS successfully places a variety of grid array packages including Ball Grid Array (BGA), Ceramic Column Grid Array (CCGA) and Land Grid Array (LGA)
Robust processes have been developed for QFNs, various RF filters and RF Shields that meet the requirements of IPC Class 3 assembly
Teledyne EMS has custom component lead forming capability when required
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