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ADVANCED ELECTRONIC SOLUTIONS
ABOUT
PRODUCTS/SERVICES
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TERMS & CONDITIONS
Teledyne Advanced Electronic Solutions
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Processes
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Assembly Cleaning
Processes
Assembly Cleaning
Automated Optical Inspection
BGA/Device Underfill
Bonding/Coating
Circuit Card Assembly
Component Placement
Material Dispensing
Pin Thru Hole Assembly
Reflow Soldering
Secondary Assembly
Solder Paste
Specialized Rework
X-Ray Inspection
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Assembly Cleaning
Teledyne EMS offers a variety of assembly cleaning options:
In-line and batch aqueous cleaning process
Saponifier options for improved removal of RMA flux chemistries
Pure DI water options for chemical sensitive components
Ongoing monitoring using Resistivity of Solvent Extract testing
All flux and wash options qualified by Surface Insulation Resistance testing
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